Basic Info.
| Package:Vacuum Packing with Desiccant, Export Carton | Specification:SGS |
| Type:Rigid Circuit Board | Dielectric:FR-4 |
| Material:Fiberglass Epoxy | Application:Aerospace |
| Flame Retardant Properties:V0 | Mechanical Rigid:Rigid |
| Processing Technology:Electrolytic Foil | Base Material:Copper |
| Insulation Materials:Epoxy Resin |